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service environment. Although this condition is not a requirement for performance based on the standard, it is provided to illustrate to users the desired condition that the creators of the criteria thought they should strive to achieve. Acceptable This condition, although not necessarily perfect, will maintain the integrity and reliability of the assembly in its service environment. Defect This condition may be insufficient to ensure the form, fit, or function of the assembly in its end-use environment. Defect conditions need to be dispositioned by the manufacturer based on design, service, and customer requirements. Disposition may be to rework, repair, scrap, or use as is. Repairing or using the assembly as is may require customer concurrence. A defect for Class 1 automatically implies a defect for Class 2 and 3. A defect for Class 2 implies a defect for Class 3. Process indicator A process indicator is a condition (not a defect) that identifies a characteristic that does not affect the form, fit, or function of a product. Such condition is a result of material, design, and/or operator- or machine-related causes that create a condition that neither fully meets the acceptance criteria nor is a defect.

As established by the predecessor military standards, process indicators are not intended to be reworked or even dispositioned, and they can be included in product delivery without correction of the product. They are, however, not desirable and indicate the relative success of the process and materials; if the process or materials could lead to defect conditions, the process may need to be adjusted or corrected for future production. Process indicators should be monitored as part of the process control system. Should the number of process indicators indicate abnormal variation in the process or identify an undesirable trend, the process should be analyzed. This analysis may result in action to reduce the variation and improve yields before there is a defect trend that may require rework or scrap or, worst of all, result in customer dissatisfaction.

TABLE 6-4

Comparison between the major classes of cutting tool materials [1]

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Workmanship Manuals Many companies use a workmanship document of some sort to describe what the operations should achieve during production. IPC-A-610 is used frequently by manufacturing and also quality personnel to determine acceptable quality levels of their product. Some companies have also developed very good workmanship manuals for their own use, especially to cover unique or uncommon design requirements. If a need exists to develop a unique workmanship manual, then this manual should reflect the intended contract requirements. It is certainly desirable to use a manual already in existence since it can become extremely costly to develop your own, and because customer review is unnecessary since the customer should already be aware of the common requirements definition. If minor changes are necessary to standard performance due to process, product or material limitations, they can often be addressed as a contractual waiver, addition, or exception to the standard definition.

1644 Chart Data Data collection, to develop conductor-sizing charts, is performed following test procedures defined in IPC-TM-650 2541a, Conductor Temperature Rise Due to Current Changes in Conductors Understanding these data, test vehicle, and test conditions used to derive conductor charts is important for understanding the limitations of these charts The chart shown in Fig 161 was created from external trace heating data from doublesided boards The internal trace chart, Fig 162, was not developed from internal trace data; it represents half the current defined in the external chart Further discussion on the internal trace chart is included in Sec 1645, Trace-Sizing Design Guidelines The external trace chart represents a best-fit line through trace temperature data points from boards with different materials (epoxy and phenolic, different board thicknesses (3175 mm [0125 in], 1587 mm [00625 in.

], and 0794 mm [00312 in]), and different copper thicknesses (1/2 oz, 1 oz, 2 oz, and 3 oz), and, most important, from boards with copper planes Board material, board thickness, copper thickness, and especially the copper planes all have an impact on the temperature rise of the trace Averaging these variables together skews the results The top curve in Fig 163 shows the original 10 C line used to create the 10 C curve in Fig 161 All of the curves in Fig 16 3 represent a 10 C rise, but each curve represents a different set of conditions Going from the top down, the next curve is supposed to represent coatings, although it is a mix of traces with coatings, thin boards, and boards that were dip-soldered The next curve represents test boards that were dip-soldered.

The last curve represents traces that were removed from the board and tested in free air The boxed area in Fig 163 is increased in size and shown in Fig 164..

Carbon steels High-speed steels Tungsten Carbides Cermets Titanium carbides Ceramics Polycrystalline diamond and cubic boron nitride Single-crystal diamond Cast alloys

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