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These epoxy blends are often used in high-frequency applications including antennas, radio frequency (RF), and wireless communications equipment, and high-speed computing applications. 7.3.2 Bismaleimide Triazine (BT)/Epoxy Typically, epoxy is added to BT resins to modify the properties of pure BT. Therefore these materials are also considered epoxy blends. BT/epoxies normally have Tg values in the range of 180 C to 220 C and exhibit a good combination of electrical, thermal and chemical resistance properties. BT/epoxy is commonly used in BGA substrates and chip scale packages since it can meet the requirements of specifications for use in semiconductor chip packaging. It is also suitable for high-density multilayers requiring good thermal, electrical, and chemical performance. The primary disadvantage of BT-based materials is cost. The greater the amount of BT, the higher the cost. BT can also be more brittle than pure epoxy systems, and moisture absorption can also be higher.

Cyanate Ester Cyanate ester systems possess very high-Tg values, typically in the neighborhood of 250 C, and exhibit very good electrical performance. Thermal stability is also good. However, cyanate esters are relatively expensive and require special processing that can add additional cost to the finished circuit. For these reasons, cyanate ester materials are still used only in niche applications. Blends with epoxies have also been used to modify processability and cost.

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Polyimide When extreme heat resistance is required, polyimide resins offer outstanding performance. With a Tg of 260 C for the purest systems to 220 C for modified or toughened systems, and very high decomposition temperatures, circuits manufactured with polyimide materials exhibit very high levels of thermal reliability. The high Tg of these resin systems also helps to minimize thermal expansion, as most of the thermal expansion occurs pre-Tg, where expansion rates are relatively low. These materials have commonly been used in burn-in boards, aerospace and avionics, down-well oil drilling, and military applications where thermal performance is vital. Again, however, these resin systems are relatively expensive and more difficult to process, generally limiting them to niche applications.

Polytetrafluoroethylene (PTFE,Teflon ) A variety of PTFE-based products are also available for applications where extremely good electrical properties are required. These materials often require very specialized processing and are relatively expensive. Hybrids of PTFE-based materials and other material types are often used to gain the performance benefits of the PTFE-based materials where needed, while controlling the total circuit cost by using other less costly materials in other layers of the multilayer circuit.

Polyphenylene Ether (PPE) PPE-based products offer superior electrical properties compared to the epoxy blends discussed above, and also offer excellent thermal performance. This resin system is well suited for RF and wireless communications and high-speed computing applications. While early versions of these resin systems were more difficult to process, improvements in resin formulation and rheology control have been made so that PPE systems can be processed using conventional PCB manufacturing processes with minor adjustments.

A finite state machine (FSM) is a formal concept with many applications. In general, a finite state machine is a device which has some inputs and some outputs. It stores the state of the machine, and depending upon the inputs, changes the state value. The outputs depend upon the state value. FSM has:

Other Resins and Formulations For many of these resins, several different types of molecular structures can be used to modify the ultimate properties of the base material. In addition, other types of resins are also in use or are being developed to meet the growing requirements for the various applications in which printed circuits are used. Often, these resins are proprietary in nature, and therefore discussions of these products focus on their properties rather than the specific chemistry used to achieve the properties. In addition, fillers are increasingly being used to modify thermal expansion or electrical performance, or both. Fillers will be discussed later in this chapter.

students attending the certification-training program were from commercial production companies with no contractual performance for DoD In addition to establishing product acceptance criteria, the specification also detailed methods for process control and defect reduction to be used in assembly One hundred percent inspection was required unless specific conditions were met, so that sample-based inspection might be used with confidence As a result of elimination of the various military standards, most DoD and termed highreliability production is defined through contractual implementation of the commercial IPC equivalent standards, such as J-STD-001, and IPC-A-610 52122 Space Production Requirements Standards associated with space applications have significantly different purposes than process control documents commonly used for large-volume production electronics.

(c) minienvironment type [20]

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